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鍾俊輝

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副教授
姓名 鍾俊輝 (Chunhui Chung)
組別 機械製造與材料組
教授室 機械系館五樓91504
分機 62138
傳真機 (06)2352973
電子信箱 chchung@mail.ncku.edu.tw
個人網站
學歷
  1. 美國紐約州立大學石溪分校 機械工程 博士 (2006/09~2010/08)
  2. 國立成功大學 機械工程 碩士 (2002/09~2004/06)
  3. 國立交通大學 機械工程 學士 (1998/09~2002/09\6)
經歷
  1. 國立成功大學 機械工程學系 副教授 (2018/08~present)
  2. 國立臺灣科技大學 機械工程系 副教授 (2016/08~2018/07)
  3. 國立臺灣科技大學 機械工程學系 助理教授 (2011/08~2016/07)
專長
  1. 切削加工
  2. 磨粒加工
  3. 振動學
  4. 高分子脫臘澆注
  5. 電腦輔助製造
教師研究介紹
服務
國際研討會籌備委員
  1. 2017 World Congress on Micro and Nano Manufacturing – A Joint Conference of ICOMM/4M/IFMM, March 27-30, Kaohsiung, Taiwan.
  2. 2014 7th Asia Workshop on Micro/Nano Forming Technology, Nov. 9-12, Taipei, Taiwan
  3. 2014 International Conference on Mechatronics Technology, Oct. 21-24, Taipei, Taiwan.
  4. 2013 14th International Conference on Metrology and Properties of Engineering Surfaces, June 17-21, Taipei, Taiwan.
  5. 2013 Taiwan-Japan-Korea Wafer Planarization Technology Symposium, Feb. 25, Taipei, Taiwan.
 
國內研討會籌備委員
  1. 2015 中華民國力學學會年會暨第39 屆全國力學會議,11 月20-21 日,國立台灣科技大學,台北,台灣。
榮譽
  1. Young Researcher Award, International Symposium of Precision Engineering and Sustainable Manufacturing (PRESM 2018), July 3-7, 2018, Sapporo, Japan.
  2. Best Oral Presentation Award, 8th International Conference on Advanced Materials Development & Performance (AMDP 2017), July 11-15, 2017, Pune, India.  
專利
著作

Journal Papers

  1. Y.-J. Chen, E. Yu, C. Chung, T. Ellingham, and L.-S. Turng* (2018, April). Improving the Processibility and Mechanical Properties of Poly(lactic acid)/Linear Low Density Polyethylene/Paraffin Wax Blends by Subcritical Gas-Assisted Processing. Polymer Engineering and Science, https://doi.org/10.1002/pen.24856, published online first.
  2. C. Chung* and C.-H. Lin (2018). Study on the Performance of Nanocomposite Wire Guides in Wire Sawing Process. International Journal of Modern Physics B, Vol. 32, No. 19, 1840077.
  3. C. Chung* and Y.-J. Chen (2018, Feb). Analysis of a Miniaturized 3D PDMS Channel Deflector Fabricated Using Lost-Wax Casting. International Journal of Advanced Manufacturing Technology,  Vol. 94, pp. 2381-2391.
  4. Y.-J. Chen, A. Huang, T. Ellingham, C. Chung, and L.-S. Turng* (2018, Jan). Mechanical Properties and Thermal Characteristics of Poly(lactic acid) and Paraffin Wax Blends Prepared by Conventional Melt Compounding and Subcritical Gas-assisted Processing (SGAP). European Polymer Journal, Vol. 98, pp. 262-272.
  5. C. Chung* (2017, Aug). Analysis of Vibration in L- and H-Shaped Planar Frame Structures Using Transfer Function. International Journal of Structural Stability and Dynamics, Vol. 17, No. 6, 1750067.
  6. C. Kuo*, Y. Hsu, C. Chung, and C.-C. A. Chen (2017, Jan). Multiple Criteria Optimisation in Coated Abrasive Grinding of Titanium Alloy Using Minimum Quantity Lubrication. International Journal of Machine Tools and Manufacture, 115, 47-59.
  7. C. Chung* and L. V. Nhat (2015, Sep). Depth of cut per abrasive in fixed diamond wire sawing. The International Journal of Advanced Manufacturing Technology, 80, 1337-1346.
  8. C. Chung*, Y.-J. Chen, P.-C. Chen, and C.-Y. Chen (2015, Aug). Fabrication of PDMS Passive Micromixer by Lost-Wax Casting. International Journal of Precision Engineering and Manufacturing, 16(9), 2033-2039.
  9. C. Chung*, G. D. Tsay, and M.-H. Tsai (2014, Jul). Distribution of Diamond Grains in Fixed Abrasive Wire Sawing Process. International Journal of Advanced Manufacturing Technology , 73, 1485–1494.
  10. C. Chung* and L. V. Nhat (2014, May). Generation of Diamond Wire Sliced Wafer Surface based on the Distribution of Diamond Grits. International Journal of Precision Engineering and Manufacturing, 15(5), 789-796.
  11. X. Zhu, C. Chung, C. S. Korach*, and I. Kao* (2013, Jul). Experimental Study and Modeling of the Effect of Mixed Size Abrasive Grits on Surface Topology and Removal Rate in Wafer Lapping. Wear, 305, 14-22.
  12. C. Chung* and I. Kao (2012, Oct). Green's Function and Force Vibration Response of Damped Axially Moving Wire. Journal of Vibration and Control, 18(12), 1798-1808.
  13. C. Chung, C. S. Korach, and I. Kao* (2011, Jun). Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes. Journal of Manufacturing Science and Engineering, 113, Paper No. 031006.
  14. C. Cao, A. Reiner, C. Chung, S.-H. Chang, I. Kao, R.V. Kukta, and C.S. Korach* (2011, Apr). Buckling Initiation and Displacement Dependence in Compression of Vertically Aligned Carbon Nanotube Arrays. Carbon, 49(10), 3190-3199.
  15. C. Chung and I. Kao* (2011, Feb). Modeling of Axially Moving Wire with Damping: Eigenfunctions, Orthogonality and Applications in Slurry Wiresaws. Journal of Sound and Vibration, 330, 2947-2963.
  16. S. Bhagavat, J. C. Liberato, C. Chung, and I. Kao* (2010, Jul). Effects of Mixed Abrasive Grits in Slurries on Free Abrasive Machining (FAM) Processes. International Journal of Machine Tools and Manufacture, 50, 843-847.

Conference Papers

  1. C. Chung* and Z.-H. Huang (2018, July). Prediction of Processing Time of CNC Machining Center Using Artificial Neural Network. International Symposium on Presion Engineering and Sustainable Manufacturing (PRESM 2018), Sapporo, Japan.
  2. C. Chung* and T.-C. Ma (2017, Dec). Implementation of CAM Programming with Machinability Database. 2017 IEEE/SICE International Symposium on System Integration, Taipei, Taiwan.
  3. C. Chung*, M.-Q. Li, and C. Kuo (2017, Dec). Study on the Diamond-Coated Wire Sawing Process of Silicon with Minimum Quantity Lubrication. The 20th International Symposium on Advances in Abrasive Technology, Okinawa Institute of Science and Technology Graduate University (OIST), Okinawa, Japan.
  4. C. Chung* and C.-H. Lin (2017, Jul). Using Nano-particle Reinforced Polyurethane as Wire Guides in Wire Sawing Process. 2017 International Conference on Advanced Materials Development and Performance (AMDP 2017), Pune, India.
  5. M.-K. Liu*, Q. M. Tran, Y.-W. Qui, and C. Chung (2017, Jun). Chatter Detection in Milling Process Based on Time-Frequency Analysis. 2017 ASME Manufacturing Science and Engineering Conference (MSEC 2017).
  6. C.L. Kuo*, C. Chung, J.H. Wen (2017, Mar). Material Removal, Surface Roughness and Abrasive Wear Following Grinding of Aluminum Alloy Using Minimum Quantity Lubrication . 2017 World Congress on Micro and Nano Manufacturing, Kaohsiung, Taiwan.
  7. C. Chung* and Y.-J. Chen (2016, Mar). Fabrication of Miniaturized PDMS Channel with a 3D Deflector Using Lost-Wax Casting. The 11th International Conference on Micromanufacturing, Irvine, CA, USA.
  8. C. Chung* and Y.-J. Chen (2014, Oct). Study on Different Wax in Lost-Wax Casting of Polymer-Based Micro Channels. 2014 International Conference on Mechatronics Technology, Taipei, Taiwan.
  9. C. Chung* and L. V. Nhat (2014, Mar). Modeling and Simulation of the Fixed Diamond Wire Sliced Wafer Surface. The 9th International Conference on Micromanufacturing, Singapore.
  10. C. Chung* and Y.-J. Chen (2014, Mar). Fabrication of Three Dimensional Structures in Polymer-Based Microchannel with Lost-Wax Casting. The 9th International Conference on Micromanufacturing, Singapore.
  11. C. Chung* and B. S. Yang (2013, Dec). Computational Study on the Effect of the Ligaments in Knee Joint during Quasi-Static Stand-to-Sit Motion. The 15th International Conference on Biomedical Engineering, Singapore.
  12. C. Chung* and I. Kao (2013, Oct). Study on the Vibration Response of Axially Moving Continua. 2013 ASME Dynamic Systems and Control Conference, Stanford, CA, USA.
  13. C. Chung* and L. V. Nhat (2013, Sep). Surface Generation of Diamond Coated Wire for Wire Sawing Process . 16th International Conference on Advances in Materials and Processing Technologies, Taipei, Taiwan.
  14. C. Chung* (2012, Jun). A Preliminary Numerical Study of the slurry Wire Sawing Process. 2012 ASME International Manufacturing Science and Engineering Conference, Notre Dame, IN, USA.
  15. C. Chung* (2012, Mar). Abrasive Distribution of the Fixed Diamond Wire in Wire Sawing Process. 2012 International Conference on Advanced Manufacturing, Yilan, Taiwan.
  16. C. Chung and C. Huang* (2011, Jun). On the Rotation Curves of Stephenson III Six-Bar Linkage. 13th World Congress in Mechanism and Machine Science, Guanajuato, Mexico.
  17. C. Chung and I. Kao* (2009, Aug.). Numerical Studies on the Frequency Response of Vibration of Damped Axially Moving Wire. 2009 ASME International Design Engineering Technical Conferences, San Diego, CA, USA.
  18. C. Chung, G. Melendez, and I. Kao* (2009, Oct) Experimental Study of Lapping Using Mixed Abrasive Grits. 2009 ASME International Manufacturing Science and Engineering Conference, West Lafayette, IN, USA.
  19. C. Chung and I. Kao* (2008, Oct.). Damped Vibration Response at Different Speeds of Wire in Slurry Wiresaw Manufacturing Operations,” 2008 ASME International Manufacturing Science and Engineering Conference, Evanston, IL, USA.
  20. C. Chung and I. Kao* (2008, Oct.). Comparison of Free Abrasive Machining Processes in Wafer Manufacturing. 2008 ASME International Manufacturing Science and Engineering Conference, Evanston, IL, USA.

Book Chapter

  1. I. Kao*, C. Chung, and R. Rodriguez. Modern Wafer Manufacturing and Slicing of Crystalline Ingots to Wafers Using Modern Wiresaw. Springer Publisher, book chapter in Springer Handbook of Crystal Growth edited by G. Dhanaraj, K. Byrappa, V. Prasad, M. Dudley, 2010: pp. 1719-1736.